Standard Course Syllabus Course Supervisor Date of Approval

Dept. of Electrical and Computer Engineering Ringel 4/05

735 Compound Semiconductor Process Technology

2. CATALOG DESCRIPTION

III-V compound semiconductor device fabrication technology; epitaxy, doping, bandgap engineering; GaAs and InP high

speed devices and IC design approaches; testing and failure mechanisms.

Quarters of Offering Credits
Level Class Meeting

Wi Qtr (even years). 3 U G 3 cl.

Course Prerequisites

Prereq: 432.

3. PREREQUISITES BY TOPIC

PN junction devices physics; semiconductor physics; diodes, bipolar devices, field effect devices

Courses that require this as a direct prerequisite

none

4. Text(s) and Other Course Materials Author(s) Publisher

GaAs High-Speed Devices: Physics, Technology and Circuit C.Y. Chang, F. Kai Wiley

Applications

ISBN: 0-471-85641-X

References (supplemental reading)

[1] C.Y. Change and F. Kai, GaAs High Speed Devices, 1994.

[2] E.H.C. Parker, The Technology and Physics of Molecular Beam Epitaxy, 1985.

[3] Cheng T. Wang, Ed., Introduction to Semiconductor Technology: GaAs and Related Compounds, John Wiley & Sons,

1990.

[4] David K. Ferry, Ed., Gallium Arsenide Technology, Howard W. Sams & Co., 1985.

[5] Avishay Katz, Ed., Indium Phosphide and Related materials: Processing, Technology and Devices, Artech House, 1992.

5. COURSE OBJECTIVES

1. Students learn about processing chemistry of compound semiconductors. (Criterion 3(a))

2. Students learn about how electronic and optical devices are built of compound semiconductors. (Criteria 3(c),(e))

3. Students learn about methods and techniques used for fabricating compound semiconductor devices used in

communications, optoelectronics, high speed wireless applications. (Criterion 3(k))

6. TOPICS AND (# OF LECTURES)

Introduction to compound semiconductor devices (1)

Material properties, alloys and heterostructures of III-V compound semiconductors (4)

Bulk crystal growth techniques (2)

Vacuum and ultra-high vacuum physics and technology (2)

Epitaxial growth methods - molecular beam epitaxy and metalorganic chemical vapor deposition (5)

Device patterning and lithography (4)

Wet chemical processing (2)

Dry chemical processing, etching and plasma processing (3)

In-class case study of a device (4)

7. CLASS MEETING PATTERN (For example, "3cl." means 3 48-min classes per week.)

3 cl.

Thursday, August 14, 2008 09:20 AM

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