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Past Reading Assignments |
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| Wednesday 3/28 | 1 - 12 | Introduction |
| 13 - 41 (optional) | Device physics review | |
| 41 - 46 | Introduction | |
| Friday 3/30 | 49 - 91 | Overview of a CMOS process |
| Monday 4/2 | 93 - 101 | Crystals, defects in silicon |
| 105 - 109 | Wafer preparation and specifications | |
| 111 - 121 | Wafer characterization | |
| 121, 131 - 143 | Modeling of defects in silicon | |
| 144 - 147 | Future trends in wafer preparation | |
| Friday 4/13 | 201 - 234 | Lithography introduction, history and basic concepts |
| Monday 4/16 | 234 - 246 | Lithography manufacturing and measurement methods |
| Monday 4/30 | 246 - 272 | Lithography modeling and simulation |
| Monday 5/7 | 609 - 637 | Etching - basic concepts |
| Wednesday 5/9 | 637 - 653 | Etching manufacturing methods and measurement methods |
| Monday 5/21 | 509 - 530 | Deposition Introduction, CVD historical development and basic concepts |
| Wednesday 5/30 | 554 - 564, 572 | CVD manufacturing methods. measurement methods |
| Wednesday 5/30 | 573 - 579, 582 - 584, 590 - 598 | CVD models and simulation |
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